la12b/12g-pf doc. no : qw0905-la12b/12g-pf rev. : a date : 08 - apr.- 2006 data sheet ligitek electronics co.,ltd. property of ligitek only led array pb lead-free parts
7.0x11=77.0 1.0min 1.4 3.0 8.0 6.0 6.2 0.5 typ 2.3typ 1.0min 12.5min 1.5max g g g g g g g g g g g g 6.1 84.5 8.5 3.75 6.0 1.3 5.2 1/5 la12b/12g-pf 2.3typ - + 13.5min 0.5 typ. ligitek electronics co.,ltd. property of ligitek only page part no. package dimensions lg5620-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. + -
typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only page 2/5 symbol ratings parameter operating temperature storage temperature -40 ~ +85 -40 ~ +100 t opr tstg peak forward current duty 1/10@10khz reverse current @5v forward current power dissipation ir i f 10 30 pd i fp 100 120 absolute maximum ratings at ta=25 unit a ma mw ma note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. forward voltage @20ma(v) peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) g part nomaterial color emittedlensmin.max. typ. min. la12b/12g-pf gap green green diffused 56530 1.7 2.60.81.8 142 la12b/12g-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page 3/5 forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip la12b/12g-pf part no.
60 seconds max 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 la12b/12g-pf part no.
page 5/5 reliability test: reference standard ligitek electronics co.,ltd. property of ligitek only 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) solder resistance test solderability test low temperature storage test thermal shock test high temperature high humidity test high temperature storage test operating life test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item test condition description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. la12b/12g-pf part no.
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